APPLICATION OF THE SIX SIGMA METHODOLOGY FOR THE LONGEVITY OF BON TOOLS IN TAB BOND MACHINES

• DOI: 10.22533/at.ed.4322228061

• Palavras-chave: -

• Keywords: Six Sigma, ultrasound solder, design of experiments, pull test, and bond tool

• Abstract:

  The research was increase longevity of the bond tools on the other hand it serves to ensure adherence in the terminal with the pad (area of ​​soldering in the integrated circuit) when the Tab Bond machines apply ultrasound solder through the tip or bond tool. It has variability in used each machine and shift of the analyzed history. Application of the Six Sigma methodology, the results after several design of experiments, it was obtained that the variables with the most influence were temperature and force that affect tip wear, the temperature was controlled on the pedestal with a thermometer to 175oC (degrees Celsius) and with a control graph, the force range was increased from 90 to 170 grams force, on the other hand, the pull test in the terminal was improved obtaining cp and cpk (process capability) greater than 1, in the 22 terminals; therefore lengthening the change time at the bond tools to maintain good adhesion not less than 30 pound force. The consumable was reduced by 10%, increasing the number of bonds greater than 1,000,000 per tip, concluding a savings of $ 18,000.

• Número de páginas: 8